top of page

You are welcome to do research together with us!

 

In the laboratory of "Vacuum deposition and high temperature processes" at 

the Department of Microelectronics (TU-Sofia), the following equipment is available:

 

1-st subsection of the lab:

 

  • vacuum deposition system for thermal evaporation and RF reactive sputtering;

  • vacuum deposition system for low temperature DC sputtering;

  • vacuum deposition system for e-beam evaporation;

  • four point probe setup for measurement of sheet and specific resistance, indirect film thickness monitoring, film uniformity, charge carrier concentration, type of doping;

  • luminancemeter connected in a computer controlled system for OLED brightness and luminous efficiency measurements, as well as CIE Colorimetry;

  • picoampermeter for low current measurements (leakage current of junctions, defects analysis, based on thermally stimulated charges from trap levels in the film);

  • RLC meter for contact resistance, lead inductance, capacity of junctions and impedance spectrocsopy analysis of devices;

  • measurement setup with Peltier elements and precise temparature sensor for studying thermal behavior of the devices (at negative and positive (higher than room) temperatures), as well as for high resolution thermal activation of charge carriers for defect analysis.

  • high voltage, broad-range frequency generator for electroluminescent stimulation in AC electroluminescent devices;

  • signal generator and 2 channel DC power supply;

  • measurement setup with precise frequency measurement device for gas sensors testing based on quartz crystal microbalance detection principle;

  • supersonic cleaner;

  • precise microbalance.

 

2-nd subsection of the lab:

 

  • furnaces for thermal oxidation of silicon;

  • furnaces for P and N doping of semiconductor wafers;

  • furnace for annealing of amorphous films and hard backing of screen printed thick films for hybride micromodules;

  • high pressure chemical vapor deposition instalation (HPCVD);

  • test setup for static and vibrational mechanical loading of devices on flexible substrate (compressive and tension stress, repeating cycles of bending);

  • digital osciloscope;

  • optical microscope.

bottom of page